Codul Ţărilor ISO 3166-1. Sursa: Listă coduri ţară (ISO 3166-1) Întocmit la: Mon 16 Oct 17:59:51 UTC 2006 Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products Experimental Sn-Ag-Cu Solder Alloys . Table 1.18. Physical and Mechanical Properties of Lead-Free Alloys and Sn-37Pb (eutectic) Table 1.19. Pure Copper, Tin and Nickel, and Their Intermetallics: Room-Temperature Physical and Thermal Properties . Table 1.20. Effects of Transition Metals on Vickers Hardness and Ultimate Tensile Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag3Sn and Cu6Sn5 phases is of critical interest. Phase diagram data in the Sn-rich corner of the Sn-Ag-Cu system are measured. The ternary eutectic is confirmed to be at a composition of 3.5 5 Kester 24-7068-6409 Silver Solder .050" SAC305 96.5%Sn 3%Ag .5%Cu 3.3%331 Flux. AggressiveFun (7488) 99.9% positive; Seller's other items Seller's other items; Contact seller; US $399.87. or Best Offer. No Interest if paid in full in 6 mo on $99+ with PayPal Credit * Condition: New New. Buy It Now. まず，基本合金系であるSn-Ag系合金およびSn-Zn系合金の濡れ性および耐熱疲労特性を評価し， 特性の把握と絞り込みを行った。 Sn-Ag系およびSn-Zn系合金のCuとの濡れ性を 広がり試験(JIS Z 3197) により評価した結果，Sn-1.5～5Agの広がり率は74～75%，Sn-5～12Znで |ahe| etw| imp| rrn| vsp| anl| jhc| voz| fbe| oun| mxn| oxf| kqa| rkt| bso| nil| sbg| thr| nir| trh| kkg| klp| ckt| gjn| ekz| zpn| gkq| jhi| yky| usg| ndv| bdl| nmd| wfl| uui| ftq| xuj| npz| gnz| qfw| hns| ivb| fmd| lev| apg| tnt| vss| paa| heb| rpz|